Polishing apparatus for a semiconductor wafer

Details Polishing apparatus for a semiconductor wafer Polishing apparatus for a semiconductor wafer

1997-12-19

1999-09-14

Eley, Timothy V.

Abrading

Machine

Combined

451288, 451495, 451529, 451550, B24B 700, B24B 2900

Patent

active

059513802

ABSTRACT:
A polishing method and apparatus thereof that selectively or continuously uses multiple kinds of polishing materials which have different polishing characteristics. The polishing materials used are based on appropriate polishing requirements of the object polished. In addition, the polishing rate and uniformity rate can be enhanced by arranging the polishing materials based on their degree of their polishing characteristics.

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patent: 5578362 (1996-11-01), Reinhardt et al.
patent: 5609517 (1997-03-01), Lafaro
patent: 5785584 (1998-07-01), Marmillion et al.

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