Polishing apparatus and polishing pad

Details Polishing apparatus and polishing pad Polishing apparatus and polishing pad

2006-07-25

2006-07-25

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

Utilizing nonrigid tool

C451S526000, C451S527000, C451S533000

Reexamination Certificate

active

07081044

ABSTRACT:
A polishing pad (10) has an upper-layer pad (11) having a hole (11a) defined therein, a light-transmittable window (41) disposed in the hole (11a) for allowing light to pass therethrough, and a lower-layer pad (12) disposed below the upper-layer pad (11) and having a light passage hole (12a) defined therein which has substantially the same diameter as the hole (11a) in the upper-layer pad (11). A transparent film (13) with an adhesive agent applied to upper and lower surfaces thereof is interposed between the upper-layer pad (11) and the lower-layer pad (12). The hole (11a) defined in the upper-layer pad (11) and the light passage hole (12a) defined in the lower-layer pad (12) have substantially the same size as each other.

REFERENCES:
patent: 5605760 (1997-02-01), Roberts
patent: 6045439 (2000-04-01), Birang et al.
patent: 6068539 (2000-05-01), Bajaj et al.
patent: 6068540 (2000-05-01), Dickenscheid et al.
patent: 6159073 (2000-12-01), Wiswesser et al.
patent: 6213845 (2001-04-01), Elledge
patent: 6358130 (2002-03-01), Freeman et al.
patent: 6379231 (2002-04-01), Birang et al.
patent: 6453502 (2002-09-01), Bishop
patent: 6558229 (2003-05-01), Kimura et al.
patent: 2001/0036805 (2001-11-01), Birang et al.
patent: 2002/0127950 (2002-09-01), Hirose et al.
patent: 2002/0137431 (2002-09-01), Labunsky et al.
patent: 0 824 995 (1997-08-01), None
patent: 1 176 630 (2002-01-01), None
patent: 2001-291686 (2001-10-01), None
patent: 2002-001647 (2002-01-01), None
patent: WO00/60650 (2000-10-01), None

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