Polishing apparatus and polishing method

Details Polishing apparatus and polishing method Polishing apparatus and polishing method

2011-07-12

2011-07-12

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S059000, C451S303000, C451S304000, C451S307000

Reexamination Certificate

active

07976361

ABSTRACT:
A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.

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