Polishing apparatus and polishing method

Details Polishing apparatus and polishing method Polishing apparatus and polishing method

2011-08-23

2011-08-23

Eley, Timothy V (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S009000, C451S010000, C451S533000, C451S550000

Reexamination Certificate

active

08002607

ABSTRACT:
A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad)201and the wafer held by a holding member (top ring)52and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring52for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag202for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.

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