Polishing apparatus and polishing method

Details Polishing apparatus and polishing method Polishing apparatus and polishing method

2005-06-20

2010-10-26

Von Buhr, M. N. (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S028000, C451S005000

Reexamination Certificate

active

07822500

ABSTRACT:
A polishing apparatus has a polishing table (18) having a polishing surface (40) and a top ring (20) for pressing a substrate against the polishing surface (40) while independently controlling pressing forces applied to a plurality of areas (C1-C4) on the substrate. The polishing apparatus has a sensor (52) for monitoring substrate conditions of a plurality of measurement points on the substrate, a monitor unit (53) for performing a predetermined arithmetic process on a signal from the sensor (52) to generate a monitor signal, and a controller (54) for comparing the monitor signal of the measurement points with the reference signal and controlling the pressing forces of the top ring (20) so that the monitor signal of the measurement point converges on the reference signal.

REFERENCES:
patent: 6190234 (2001-02-01), Swedek et al.
patent: 6276989 (2001-08-01), Campbell et al.
patent: 6468131 (2002-10-01), Korovin
patent: 6477447 (2002-11-01), Lin
patent: 6492273 (2002-12-01), Hofmann et al.
patent: 6562185 (2003-05-01), Avanzino et al.
patent: 6594542 (2003-07-01), Williams
patent: 6648729 (2003-11-01), Lai et al.
patent: 6706541 (2004-03-01), Toprac et al.
patent: 6776692 (2004-08-01), Zuniga et al.
patent: 6914000 (2005-07-01), Kamada
patent: 6935922 (2005-08-01), Lehman et al.
patent: 6991516 (2006-01-01), David et al.
patent: 7024268 (2006-04-01), Bennett et al.
patent: 7030018 (2006-04-01), Lehman et al.
patent: 7074109 (2006-07-01), Bennett et al.
patent: 7223690 (2007-05-01), Kondo et al.
patent: 7247080 (2007-07-01), Bennett et al.
patent: 7332438 (2008-02-01), Lehman et al.
patent: 7455785 (2008-11-01), Koike et al.
patent: 2001/0008827 (2001-07-01), Kimura et al.
patent: 2001/0036676 (2001-11-01), Mitsuhashi et al.
patent: 2002/0001862 (2002-01-01), Ushio et al.
patent: 2002/0016066 (2002-02-01), Birang et al.
patent: 2002/0055192 (2002-05-01), Redeker et al.
patent: 2003/0171071 (2003-09-01), Kimura et al.
patent: 2003/0176081 (2003-09-01), Redeker et al.
patent: 2003/0178587 (2003-09-01), Kim et al.
patent: 2003/0205664 (2003-11-01), Abe et al.
patent: 2004/0059456 (2004-03-01), Bode et al.
patent: 2004/0224613 (2004-11-01), Kimura et al.
patent: 2004/0242121 (2004-12-01), Hirokawa et al.
patent: 2005/0142991 (2005-06-01), Nakao et al.
patent: 2005/0181706 (2005-08-01), Berman et al.
patent: 2005/0239371 (2005-10-01), Togawa
patent: 2007/0243794 (2007-10-01), Mundt
patent: 1 116 552 (2001-07-01), None
patent: 2003-512519 (2003-04-01), None

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