Polishing apparatus and polishing method

Abrading – Machine – Combined

Patent

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356381, B24B 700

Patent

active

061428558

ABSTRACT:
In order to measure a thickness of a surface to be polished of a material to be polished for a short time, two-dimensional images are obtained from a light reflected from the surface to be polished of the material to be polished, a location at which a thickness is to be observed is specified by the obtained two-dimensional images, and thickness measurement is carried out.

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