Polishing apparatus and method using a rotary work holder travel

Abrading – Machine – Stationary tool

Patent

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Details

451 41, 451320, 451314, 451317, 451394, 451398, 451143, 451246, B24B 700

Patent

active

054876974

ABSTRACT:
The present invention relates to an apparatus for polishing semiconductor wafers and, in particular, one in which the polishing pads are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross-section along this linear dimension. In addition, the wafer holder travels in a straight line parallel to the long linear dimension of the polishing pads.

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patent: 5123214 (1992-06-01), Ishimura et al.
patent: 5230184 (1993-07-01), Bukhman

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