Polishing apparatus and method of polishing work piece

Abrading – Abrading process – Abradant supplying

Reexamination Certificate

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Details

C451S041000, C451S285000

Reexamination Certificate

active

11443390

ABSTRACT:
The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel; a polishing plate provided in the pressure vessel; a pressing plate pressing a work piece onto the polishing plate; a driving unit relatively moving the polishing plate with respect to the pressing plate so as to polish the work piece; a gas supplying source supplying an alkaline gas or an acid gas into the pressure vessel; a gas discharging section discharging the supplied gas from the pressure vessel; and a slurry supplying unit supplying slurry onto the polishing plate. A pH value of the slurry is adjusted by dissolving the alkaline gas or the acid gas in the slurry.

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patent: 7070486 (2006-07-01), Doi et al.
patent: 2002/0055323 (2002-05-01), McClain et al.
patent: 1 316 393 (2003-06-01), None
patent: 2003-225859 (2003-08-01), None
patent: WO- 00/18544 (2000-04-01), None
patent: WO- 02/38335 (2002-05-01), None
U.S. Appl. No. 10/303,156, filed Nov. 22, 2002, Doy.

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