Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1997-07-21
1999-09-07
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
451287, B24B 4900
Patent
active
059482052
ABSTRACT:
To planarize an insulating film formed on a semiconductor substrate, a polishing slurry containing cerium oxide is used to polish the surface of the insulating film. Using the cerium oxide included slurry as a polishing agent, the insulating film is not contaminated by alkali metals during the polishing process. Furthermore, the insulating film is polished at an enhanced polishing rate.
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Aoki Riichirou
Kodera Masako
Okano Haruo
Shigeta Atsushi
Yajima Hiromi
Dang Thi
Kabushiki Kaisha Toshiba
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