Polishing apparatus and method for forming an integrated...

Details Polishing apparatus and method for forming an integrated... Polishing apparatus and method for forming an integrated...

2005-11-15

2005-11-15

Eley, Timothy V. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S009000, C451S527000, C451S529000, C451S550000

Reexamination Certificate

active

06964598

ABSTRACT:
In one embodiment, a semiconductor substrate (38) is uniformly polished using a polishing pad (16) that has a first polishing region (26), a second polishing region (28), and a third polishing region (30). The semiconductor substrate (38) is aligned to the polishing pad (16), such that the center of the semiconductor substrate (38) overlies the second polishing region (28), and the edge of the semiconductor substrate overlies the first polishing region (26) and the third polishing region (30). During polishing, the semiconductor substrate (38) is not radially oscillated over the surface of the polishing pad, and as a result a more uniform polishing rate is achieved across the semiconductor substrate (38). This allows the semiconductor substrate (38) to be uniformly polished from center to edge, and increases die yield because die located on the semiconductor substrate (38) are not over polished.

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