Polishing apparatus and method for detecting foreign matter...

Details Polishing apparatus and method for detecting foreign matter... Polishing apparatus and method for detecting foreign matter...

2007-04-24

2007-04-24

Eley, Timothy V. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S036000, C451S041000, C451S059000, C451S063000, C451S288000, C451S290000

Reexamination Certificate

active

10504873

ABSTRACT:
A polishing apparatus comprises a polishing tool having a polishing surface, and a holder device (top ring) for holding a semiconductor wafer (a substrate). The polishing apparatus further comprises a color CCD camera for taking a color image of a region on the polishing surface; an image processor for determining whether or not any foreign matter exists on the polishing surface based on a condition of a color in color image data acquired by the color CCD camera; and an apparatus operation control section which in response to determination of the image processing section, stops relative movement between the semiconductor wafer and the polishing surface and separates the top ring and the polishing surface from each other.

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