Polishing apparatus and method, and wafer evacuation program

Details Polishing apparatus and method, and wafer evacuation program Polishing apparatus and method, and wafer evacuation program

2005-08-30

2005-08-30

Thomas, David B. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S008000

Reexamination Certificate

active

06935930

ABSTRACT:
In a wafer polishing apparatus which polishes a wafer surface or in a wafer cleaner, there are provided a transfer and cleaning chamber which shuts off a wafer from the outside air and an inert gas supply device which fills an inert gas into the transfer and cleaning chamber. Thus, there are provided a polishing apparatus, a cleaner, a cleaning method and a wafer evacuation program which can prevent the oxidation and modification of a wafer surface in each step, such as the polishing step of a wafer, the transfer step after polishing, the cleaning step after polishing, the drying step after polishing, the inspection step after polishing, and the storage step after polishing.

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Electronic Materials, vol. 40, No. 3, p. 96.
The Latest CMP Process and Material Technlogy Supervised by Toshiro Doi and Masaharu Kinoshita, Technical Information Society, p. 257, p. 261, p. 272.

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