Polishing apparatus and method

Details Polishing apparatus and method Polishing apparatus and method

1999-02-08

2000-07-25

Banks, Derris H.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 9, 451287, 451443, B24B 4900, B24B 5100

Patent

active

060930802

ABSTRACT:
A polishing apparatus and method capable of polishing stably irrelevant of disorder such as the change of a polishing object, change of a polishing device with lapse of time. A polishing apparatus includes polishing pad 1, polishing table 3 with the polishing pad adhered thereto, table motor 8 for driving the polishing table 3, conditioning device 5 of the polishing pad 1 and conditioning control system 12 for setting conditioning conditions. According to a polishing method of the present invention, conditioning conditions of the polishing pad 1 are set on based on a frictional force exerted between the polishing pad 1 and a substrate or on torque current 10.

REFERENCES:
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5639388 (1997-06-01), Kimura et al.
patent: 5743784 (1998-04-01), Birang et al.
patent: 5904608 (1999-05-01), Watanabe
patent: 5904609 (1999-05-01), Fukuroda et al.
S. Inaba et al., "Study of CMP Polishing Pad Control Method", 1998 Proceedings Third International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC), Feb. 19 1998, pages: No Page Numbering.
S. Inaba, et al., "Study of CMP Polishing Pad Control Method", 1998 Proceedings Third International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC), Feb. 19, 1998, pp. 44-51.

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