Polishing apparatus and dressing method for polishing tool

Details Polishing apparatus and dressing method for polishing tool Polishing apparatus and dressing method for polishing tool

2005-05-31

2005-05-31

Hall, III, Joseph J. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S036000, C451S041000, C451S056000, C451S060000, C451S286000, C451S287000, C451S288000, C451S289000, C451S443000, C451S444000, C451S910000

Reexamination Certificate

active

06899592

ABSTRACT:
In a polishing apparatus, a polishing tool including abrasive particles and a binder for bonding together the abrasive particles is pressed against a substrate to polish the substrate. The polishing apparatus has a light source for irradiating a polishing surface with light rays for weakening a bond force of the binder for bonding together the abrasive particles, and a waste matter removing mechanism for forcefully removing waste matter produced by polishing or waste matter produced by irradiation. By irradiating the polishing surface with the light rays, dressing of the polishing surface is performed, and products resulting from dressing and the like are removed. The polishing apparatus supplies abrasive particles to the polishing surface stably by dressing and allows high-speed polishing of the substrate.

REFERENCES:
patent: 6126523 (2000-10-01), Moriyasu et al.
patent: 6270396 (2001-08-01), Uchiyama
patent: 6609962 (2003-08-01), Wakabayashi et al.
patent: 6672945 (2004-01-01), Matsuo et al.
patent: 2003/0100246 (2003-05-01), Hirokawa et al.
patent: 2002-324771 (2002-11-01), None
Pending U.S. Appl. No. 09/641,347, filed Aug. 18, 2000, in the name of Matsuo et al.

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