Abrading – Machine – Rotary tool
Patent
1994-09-01
1996-07-09
Kisliuk, Bruce M.
Abrading
Machine
Rotary tool
451 41, B24B 500
Patent
active
055339247
ABSTRACT:
A wafer polishing apparatus includes: a) a rotatable polishing platen; b) a polishing pad received outwardly of the polishing platen; c) a wafer carrier head, the wafer carrier head being mounted for selective rotation relative to the polishing platen; the wafer carrier head including a wafer carrier apparatus for use in polishing a semiconductor wafer having a particular orientation edge discontinuity shape, the wafer carrier apparatus including, i) a base support mounted to rotate with the carrier head; and ii) a wafer carrier ring separately rotatably received relative to the base support, the wafer carrier ring having an internal periphery which is sized and shaped to receive the particular semiconductor wafer for which the apparatus is adapted, the wafer carrier ring internal periphery including a portion which is sized and shaped to mate with the particular orientation edge discontinuity shape. A polishing process is also disclosed using this and other apparatus.
REFERENCES:
patent: 3374582 (1968-03-01), Boettcher
patent: 3453783 (1969-07-01), Queen
patent: 4753049 (1988-06-01), Mori
patent: 5216843 (1993-06-01), Breivogel et al.
Sandhu Gurtej S.
Sharan Sujit
Stroupe Hugh
Kisliuk Bruce M.
Micro)n Technology, Inc.
Weinberg Andrew
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