Polishing apparatus

Details Polishing apparatus Polishing apparatus

2011-05-17

2011-05-17

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S289000, C451S388000, C451S398000

Reexamination Certificate

active

07942725

ABSTRACT:
A polishing apparatus has a top ring configured to hold a semiconductor wafer on a substrate holding surface, and a pushser configured to deliver the semiconductor wafer to the top ring and receive the semiconductor wafer from the top ring. The pushser includes a push stage having a substrate placement surface on which the semiconductor wafer is placed and an air cylinder configured to vertically move the push stage. The pushser also includes a high-pressure fluid port configured to eject a high-pressure fluid toward the semiconductor wafer.

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