Polishing apparatus

Abrading – Abrading process – Glass or stone abrading

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Details

451 66, 451 67, 451288, B24B 100

Patent

active

06036582&

ABSTRACT:
A polishing apparatus for polishing semiconductor wafers has a space divided into a plurality of rooms cleaned to different degrees. A storage unit for storing semiconductor wafers is disposed in one of the rooms. A polishing unit for chemically and mechanically polishing a semiconductor wafer supplied from the storage unit is disposed in another one of the rooms. A delivery gate is disposed between the storage unit and the polishing unit and has a temporary storage chamber defined therein for temporarily storing a semiconductor wafer therein.

REFERENCES:
patent: 5653623 (1997-08-01), Kimura et al.
patent: 5655054 (1997-08-01), Oishi et al.
patent: 5679059 (1997-10-01), Nishi et al.
patent: 5779520 (1998-07-01), Hayakawa
patent: 5827110 (1998-10-01), Yajima et al.
patent: 5830045 (1998-11-01), Togawa et al.
patent: 5904611 (1999-05-01), Takahashi et al.

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