Abrading – Machine – Combined
Patent
1997-02-26
2000-04-18
Rose, Robert A.
Abrading
Machine
Combined
451288, 451 73, B24B 722
Patent
active
060508841
ABSTRACT:
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.
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Pending U.S. application Serial No. 08/795,511, filed Feb. 5, 1997, by Norio Kimura et al., entitled "Polishing Apparatus".
Patent Abstracts of Japan, vol. 096, No. 010, Oct. 31, 1996 & JP 08 153693 A (Toshiba Mach. Co. Ltd.) * abstract *.
Kojima Shunichiro
Nishi Toyomi
Togawa Tetsuji
Yamaguchi Kuniaki
Ebara Corporation
Rose Robert A.
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