Polishing apparatus

Details Polishing apparatus Polishing apparatus

1994-06-24

1996-04-23

Kisliuk, Bruce M.

Abrading

Machine

Reciprocating tool

451173, 451304, B24B 900, B24B 500, B24B 2100

Patent

active

055098509

ABSTRACT:
An apparatus has a polishing head for polishing an object such as a semiconductor wafer by using a polishing tape stretched between two guide rollers. The head can be rotated so as to change the angle of contact between the tape and the object and also undergo a reciprocating motion perpendicular to the direction of supply of the tape. For this purpose, the apparatus includes a first plate attached to the head and a second plate supported parallel to each other and in motion-communicating relationship by means of rods which are attached to the first plate and penetrate the second plate. The second plate is attached to the rotary shaft of a direct drive motor for causing oscillatory angular motion. This rotary shaft is tubular and an inner shaft for causing the oscillatory motion passes slidably therethrough.

REFERENCES:
patent: 2726491 (1955-05-01), Smedley
patent: 3116572 (1964-01-01), Dreiling
patent: 3800475 (1974-04-01), Partal
patent: 3853499 (1974-12-01), Larson et al.
patent: 4186527 (1980-02-01), Hausermann et al.
patent: 4528776 (1985-07-01), Estabrok
patent: 4796387 (1989-01-01), Johnson
patent: 4951420 (1990-08-01), Sorg
patent: 5027560 (1991-07-01), Coburn et al.
patent: 5403227 (1995-04-01), Franklin et al.

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