Polishing apparatus

Details Polishing apparatus Polishing apparatus

1997-01-23

2000-10-31

Utech, Benjamin L.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

451 72, 451259, 451287, 451288, 451451, 451455, C23F 102, B24B 5504

Patent

active

06139677&

ABSTRACT:
A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface thereof, a top ring 75 for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool 79 for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover 10 which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes 17 and 21 formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.

REFERENCES:
patent: 3000148 (1961-09-01), Bovensiepen
patent: 4974370 (1990-12-01), Gosis
patent: 5421768 (1995-06-01), Fujiwara et al.
patent: 5653623 (1997-08-01), Kimura et al.
patent: 5655954 (1997-08-01), Oishi et al.
patent: 5716264 (1998-02-01), Kimura et al.
U.S. patent application Ser. No. 08/357176, filed Dec. 13, 1994, by Norio Kimura et al., entitled "Polishing Apparatus", allowed Dec. 23, 1996, Issued as U.S. Pat. 5,653,623.

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