Polishing apparatus

Abrading – Precision device or process - or with condition responsive... – Computer controlled

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451 9, 451 10, 451 41, 451288, 451 63, B24B 100

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059513683

ABSTRACT:
The polishing apparatus can control the attitude of the top ring with respect to a surface of a turntable of a polishing apparatus is controlled so as to provide a uniform polish surface pressure across the entire polish surface. The polishing apparatus includes the turntable having an abrading surface, a top ring for holding an object to be polished to keep the object surface in moving contact with the abrading surface while rotating the turntable and the top ring, a magnetic bearing assembly for supporting a rotation shaft of the top ring by means of a thrust bearing device and at least one radial bearing device, and an attitude controller for controlling an orientation of the top ring with respect to the turntable through the magnetic bearing assembly.

REFERENCES:
patent: 5133158 (1992-07-01), Kihara et al.
patent: 5205078 (1993-04-01), Takara et al.
patent: 5562528 (1996-10-01), Ueyama et al.
patent: 5567199 (1996-10-01), Huber et al.
patent: 5573443 (1996-11-01), Yasuda et al.
patent: 5643056 (1997-07-01), Hirose et al.
patent: 5730642 (1998-03-01), Sandhu et al.
Pending U.S. Patent Application No. 08/684,941, filed Jul. 19, 1996, entitled "Polishing Apparatus", located in Group Art Unit 3723, by Noburu Shimizu, allowed Jun. 8, 1998 (Batch No. F03).

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