Polishing apparatus

Details Polishing apparatus Polishing apparatus

1998-02-24

1999-11-09

Marquis, Melvyn I.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C23F 102

Patent

active

059806850

ABSTRACT:
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, and a top ring having a pressing surface for holding a workpiece to be polished and pressing the workpiece against the polishing surface of the turntable. At least one of the polishing surface of the turntable and the pressing surface of the top ring is a curved surface such as a convex surface or a concave.

REFERENCES:
patent: 4918869 (1990-04-01), Kitta
patent: 5605499 (1997-02-01), Sugiyama et al.
patent: 5651724 (1997-07-01), Kimura et al.
patent: 5840202 (1998-11-01), Walsh

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