Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With means for passing discrete workpiece through plural...
Reexamination Certificate
2005-03-14
2009-12-15
Moore, Karla (Department: 1792)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With means for passing discrete workpiece through plural...
C156S345120, C156S345140
Reexamination Certificate
active
07632378
ABSTRACT:
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.
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Kaitoh Tei et al., “Planarization of Device Wafer with Fixed Abrasive Particles (Second Report)”—Planarization Working Characteristics with Fine Silica Grindstone—, from the Japan Society for Precision Engineering.
U.S. Appl. No. 09/518,958, filed Mar. 3, 2000, entitled “Polishing Apparatus”, by Kunihiko Sakurai et al., a C-I-P of U.S. Appl. No. 09/476,905, filed Jan. 3, 2000.
Hayama Takuji
Koga Daisuke
Saito Kenichiro
Sakurai Kunihiko
Sekimoto Masahiko
Ebara Corporation
Moore Karla
Wenderoth , Lind & Ponack, L.L.P.
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