Polishing apparatus

Details Polishing apparatus Polishing apparatus

2004-10-14

2008-11-04

Nguyen, Dung Van (Department: 3723)

Abrading

Machine

Rotary tool

C451S388000, C451S398000

Reexamination Certificate

active

07445543

ABSTRACT:
A polishing apparatus has a top ring configured to hold a semiconductor wafer on a substrate holding surface, and a pushser configured to deliver the semiconductor wafer to the top ring and receive the semiconductor wafer from the top ring. The pushser includes a push stage having a substrate placement surface on which the semiconductor wafer is placed and an air cylinder configured to vertically move the push stage. The pushser also includes a high-pressure fluid port configured to eject a high-pressure fluid toward the semiconductor wafer.

REFERENCES:
patent: 5738574 (1998-04-01), Tolles et al.
patent: 6080046 (2000-06-01), Shendon et al.
patent: 6086457 (2000-07-01), Perlov et al.
patent: 6102057 (2000-08-01), Vogtmann et al.
patent: 6126517 (2000-10-01), Tolles et al.
patent: 6131589 (2000-10-01), Vogtmann et al.
patent: 6267642 (2001-07-01), Vogtmann et al.
patent: 6283827 (2001-09-01), Vogtmann et al.
patent: 6325698 (2001-12-01), Wada et al.
patent: 6354922 (2002-03-01), Sakurai et al.
patent: 6358128 (2002-03-01), Sakurai et al.
patent: 6405740 (2002-06-01), Vogtmann et al.
patent: 6505635 (2003-01-01), Vogtmann et al.
patent: 6796881 (2004-09-01), Vogtmann et al.
patent: 7044832 (2006-05-01), Yilmaz et al.
patent: 7063598 (2006-06-01), Isobe et al.
patent: 2001/0055937 (2001-12-01), Wada et al.
patent: 2002/0045410 (2002-04-01), Sakurai et al.
patent: 2003/0211812 (2003-11-01), Isobe et al.
patent: 2004/0137823 (2004-07-01), Sakurai et al.
patent: 2004/0221874 (2004-11-01), Wada et al.
patent: 0 774 323 (1997-05-01), None
patent: 1 034 887 (2000-09-01), None
patent: 8-229807 (1996-09-01), None
patent: 99/41022 (1999-08-01), None

Affiliated with

Also associated with

Rating

Polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4050371