Polishing apparatus

Details Polishing apparatus Polishing apparatus

2007-08-21

2007-08-21

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S009000, C451S287000, C451S398000, C156S345140, C156S345280

Reexamination Certificate

active

10739134

ABSTRACT:
A polishing apparatus comprises a polishing table having a polishing surface and a top ring for holding a substrate to be polished, in which the substrate when held by the top ring is pressed against the polishing surface of the polishing table and thus polished. A capacitance type sensor and/or an eddy-current type sensor is disposed at one or more location(s) in the vicinity of the top ring. The capacitance type sensor detects escaping of the substrate to be polished based on a change in capacitance between the capacitance type sensor and a top surface of the polishing table. The eddy-current type sensor detects escaping of the substrate to be polished based on a change in electrical resistance between the eddy-current type sensor and the top surface of the polishing table.

REFERENCES:
patent: 6280291 (2001-08-01), Gromko et al.
patent: 6621264 (2003-09-01), Lehman et al.
patent: 6634924 (2003-10-01), Ono et al.
patent: 6699791 (2004-03-01), Hofmann et al.
patent: 6709314 (2004-03-01), Kaushal et al.
patent: 6811466 (2004-11-01), Swedek et al.
patent: 6878038 (2005-04-01), Johansson et al.
patent: 6951624 (2005-10-01), Gotkis et al.

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