Polishing apparatus

Abrading – Machine – Rotary tool

Reexamination Certificate

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Details

C451S288000, C451S289000, C451S398000, C451S443000

Reexamination Certificate

active

11088191

ABSTRACT:
The polishing apparatus is capable of precisely controlling polishing pressure, correctly positioning a press plate and uniformly polishing a workpiece. In the polishing apparatus, a holding head comprises: first pressing means for introducing a pressurized fluid into a first fluid chamber and pressing a main head section downward; second pressing means for introducing a pressurized fluid into a second fluid chamber and pressing a press plate downward; and third pressing means for introducing a pressurized fluid into a third fluid chamber and pressing the workpiece downward. With this structure, the workpiece is held on the lower side of an elastic sheet member, and the lower face of the workpiece can be polished by a polishing plate.

REFERENCES:
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patent: 5885140 (1999-03-01), Hakomori
patent: 6135858 (2000-10-01), Takahashi
patent: 2001/0000775 (2001-05-01), Zuniga et al.
patent: 2001/0053665 (2001-12-01), Lee et al.
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patent: 2003/0139123 (2003-07-01), Somekh
patent: 2005/0020185 (2005-01-01), Zuniga et al.
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patent: 2005/0153635 (2005-07-01), Boo et al.
patent: 2006/0099892 (2006-05-01), Togawa et al.
patent: 2006/0128277 (2006-06-01), Maloney et al.
patent: 2006/0199479 (2006-09-01), Togawa et al.
patent: 0 841 123 (1998-05-01), None
patent: 1 029 633 (2000-08-01), None
patent: 3158934 (2001-02-01), None

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