Polishing apparatus

Details Polishing apparatus Polishing apparatus

2006-04-04

2006-04-04

Shakeri, Hadi (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S005000, C451S287000, C438S016000

Reexamination Certificate

active

07021991

ABSTRACT:
A polishing apparatus has a polishing table having a polishing surface, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the polishing table, and a film thickness measuring device embedded in the polishing table. The film thickness measuring device includes a light source for applying light having a predetermined wavelength to a surface of the workpiece, a spectroscope for separating light reflected from the surface of the workpiece, and a charge coupled device array for capturing light separated by the spectroscope. The polishing apparatus also has a controller operable to analyze information captured by the charge coupled device array over the entire surface of the workpiece to obtain a film thickness at a desired point on the surface of the workpiece.

REFERENCES:
patent: 5254830 (1993-10-01), Zarowin et al.
patent: 5672091 (1997-09-01), Takahashi et al.
patent: 5838447 (1998-11-01), Hiyama et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 5899792 (1999-05-01), Yagi
patent: 5910846 (1999-06-01), Sandhu
patent: 6004187 (1999-12-01), Nyui et al.
patent: 6102775 (2000-08-01), Ushio et al.
patent: 6108092 (2000-08-01), Sandhu
patent: 6159073 (2000-12-01), Wiswesser et al.
patent: 6280289 (2001-08-01), Wiswesser et al.
patent: 6296548 (2001-10-01), Wiswesser et al.
patent: 6334807 (2002-01-01), Lebel et al.
patent: 6399501 (2002-06-01), Birang et al.
patent: 6476921 (2002-11-01), Saka et al.
patent: 6494766 (2002-12-01), Wiswesser et al.
patent: 6503767 (2003-01-01), Korovin
patent: 6506097 (2003-01-01), Adams et al.
patent: 6511363 (2003-01-01), Yamane et al.
patent: 6524165 (2003-02-01), Wiswesser et al.
patent: 6537832 (2003-03-01), Otsubo et al.
patent: 6607422 (2003-08-01), Swedek et al.
patent: 6716085 (2004-04-01), Wiswesser et al.
patent: 6719818 (2004-04-01), Birang et al.
patent: 6821794 (2004-11-01), Laursen et al.
patent: 1066925 (2001-01-01), None
patent: 02/103777 (2002-12-01), None
patent: 02/103779 (2002-12-01), None

Affiliated with

Also associated with

Rating

Polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3525809