Polishing apparatus

Details Polishing apparatus Polishing apparatus

1997-11-10

1999-03-16

Morgan, Eileen P.

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

451 41, 451285, 451287, 451 53, B24B 4900

Patent

active

058822445

ABSTRACT:
A polishing apparatus makes it possible to accurately detect the temperature of a workpiece during polishing and to perform polishing end point determination on the basis of this detected temperature. The polishing apparatus polishes irregularities in a surface of a workpiece such as for example a semiconductor wafer to a flat and mirror-like finish. A top ring holding a semiconductor wafer is provided with a temperature sensor. Frictional heat generated in the semiconductor wafer by polishing is detected by the temperature sensor, and a polishing end point is determined on the basis of the detected temperature.

REFERENCES:
patent: 4450652 (1984-05-01), Walsh
patent: 5113622 (1992-05-01), Nishigughi et al.
patent: 5127196 (1992-07-01), Morimoto et al.
patent: 5196353 (1993-03-01), Sandhu et al.
patent: 5245294 (1993-09-01), Salugsugan
patent: 5499733 (1996-03-01), Litvak

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