Polishing apparatus

Details Polishing apparatus Polishing apparatus

2005-04-12

2005-04-12

Hail, III, Joseph J. (Department: 3723)

Abrading

Machine

Combined

C451S041000, C451S332000, C269S060000

Reexamination Certificate

active

06878044

ABSTRACT:
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

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