Polishing apparatus

Details Polishing apparatus Polishing apparatus

1994-05-04

1996-10-08

Kisliuk, Bruce M.

Abrading

Precision device or process - or with condition responsive...

451285, 451287, 451289, B24B 500

Patent

active

055625240

ABSTRACT:
Apparatus for polishing a side of a thin, flat wafer of a semiconductor material includes first and second polishing heads which each hold a wafer against a wetted polishing surface and which each rotate and oscillate its respective wafer over the polishing surface. When the first polishing head is moved away from the polishing surface to clean, eject, and replace its wafer, the second polishing head occupies the space over the polishing surface normally occupied by the first polishing head so that the polishing surface is used substantially continuously, and not intermittently.

REFERENCES:
patent: 3857123 (1974-12-01), Walsh
patent: 4141180 (1979-02-01), Gill, Jr. et al.
patent: 4193226 (1980-03-01), Gill, Jr. et al.
patent: 4481741 (1984-11-01), Bouladon et al.
patent: 4837979 (1989-06-01), Ishida et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5361545 (1994-11-01), Nakamura

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