Polishing agent used for polishing semiconductor wafers and poli

Details Polishing agent used for polishing semiconductor wafers and poli Polishing agent used for polishing semiconductor wafers and poli

1997-08-21

1999-04-06

Utech, Benjamin

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

216 89, H01L 21302, B44C 122

Patent

active

058913530

ABSTRACT:
A semiconductor wafer polishing agent contains mainly a silica containing polishing agent and is added with a polyolefin type fine particle material. The novel semiconductor wafer polishing agent is capable of low brightness polishing to the back face of the wafer, sensor detection of the front and back faces of the wafer, and suppression of dust to be generated by chipping of the back face of the wafer, thereby to increase the yield of semiconductor devices. A polishing method using the polishing agent and a novel semiconductor wafer having a back face with an unconventional surface shape are also disclosed.

REFERENCES:
patent: 4276114 (1981-06-01), Takano et al.
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5352277 (1994-10-01), Sasaki
patent: 5429711 (1995-07-01), Watanabe et al.
patent: 5494862 (1996-02-01), Kato et al.
patent: 5534294 (1996-07-01), Kubota et al.

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