Stock material or miscellaneous articles – Circular sheet or circular blank
Patent
1996-06-20
1999-02-02
Breneman, R. Bruce
Stock material or miscellaneous articles
Circular sheet or circular blank
148 33, B32B 302, H01L 2900
Patent
active
058662260
ABSTRACT:
A semiconductor wafer polishing agent contains mainly a silica containing polishing agent and is added with a polyolefin type fine particle material. The novel semiconductor wafer polishing agent is capable of low brightness polishing to the back face of the wafer, sensor detection of the front and back faces of the wafer, and suppression of dust to be generated by chipping of the back face of the wafer, thereby to increase the yield of semiconductor devices. A polishing method using the polishing agent and a novel semiconductor wafer having a back face with an unconventional surface shape are also disclosed.
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Jan Haisma et al., "Improved Geometry of Double-Sided Polished Parallel Wafers Prepared For Direct Wafer Bonding", Applied Optics, vol. 33, pp. 7945-7954 (1994).
Patent Abstracts of Japan, vol. 010, No. 217, 29 Jul. 1986 & JP 61 054614 A, 18 Mar. 1986.
Fukami Teruaki
Kudo Hideo
Masumura Hisashi
Suzuki Kiyoshi
Breneman R. Bruce
Goudreau George
Shin-Etsu Handotai & Co., Ltd.
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