Polishing agent and lapping method

Details Polishing agent and lapping method Polishing agent and lapping method

2006-01-10

2006-01-10

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S036000, C451S268000, C451S262000, C451S287000, C051S295000

Reexamination Certificate

active

06984167

ABSTRACT:
Disclosed are a polishing agent containing at least globular-silica powder and alumina powder, as well as a lapping method in which a workpiece is held between an upper turn table and a lower turn table and is lapped by rotating the upper and the lower turn tables while being supplied with a polishing agent, wherein the polishing agent supplied is the polishing agent containing at least globular-silica powder and alumina powder. Thus, there can be provided a polishing agent capable of further improving the quality, especially, the flatness of workpieces such as silicon wafers and capable of polishing the workpieces at an excellent polishing rate.

REFERENCES:
patent: 6196901 (2001-03-01), Minami
patent: 6261476 (2001-07-01), Kwok et al.
patent: 6491837 (2002-12-01), Liu et al.
patent: 6641632 (2003-11-01), Ronay
patent: A 8-17770 (1996-01-01), None
“Precision Process Technology of Crystalline Material for Electronics”, Science Forum Inc., Edited by Masahisa Matsunaga et al., pp. 257-261.

Affiliated with

Also associated with

Rating

Polishing agent and lapping method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing agent and lapping method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing agent and lapping method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3537099