Polishing agent

Compositions – Etching or brightening compositions

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C216S089000, C438S693000

Reexamination Certificate

active

07833435

ABSTRACT:
The invention relates to the use of gluconates in the production of semiconductor wafers, preferably in the polishing of the semiconductor wafers during the production process, and to a polishing agent based on an abrasive substance and/or colloid and a mixture of disuccinates or methylglycine diacetic acid (MGDA) and gluconates.

REFERENCES:
patent: 4915710 (1990-04-01), Miyazaki et al.
patent: 5366542 (1994-11-01), Yamada et al.
patent: 5859273 (1999-01-01), Wilson et al.
patent: 6083840 (2000-07-01), Mravic et al.
patent: 6107518 (2000-08-01), Groth et al.
patent: 6338743 (2002-01-01), Dusemund et al.
patent: 6538142 (2003-03-01), Breviglieri et al.
patent: 2002/0124474 (2002-09-01), Wojtczak et al.
patent: 2002/0170237 (2002-11-01), Vogt et al.
patent: 19713911 (1998-10-01), None
patent: 19817087 (1998-11-01), None
patent: 10063488 (2002-06-01), None
patent: 10304894 (2003-09-01), None
patent: 1229094 (2002-08-01), None
patent: 2001077063 (2001-03-01), None
patent: 2001176826 (2001-06-01), None
patent: 2006150482 (2006-06-01), None
patent: WO-0106553 (2001-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polishing agent does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing agent, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing agent will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4181637

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.