Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2007-11-27
2007-11-27
Rachuba, M. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S006000, C451S041000, C451S285000
Reexamination Certificate
active
10568085
ABSTRACT:
A polished state monitoring apparatus capable of easily grasping the progress of polishing is provided. The polished state monitoring apparatus monitors the progress of polishing of a surface to be polished by obtaining a characteristic value indicating a state of the polished surface of an object at each sampling point every predetermined interval while scanning the surface. The apparatus includes light emitting means capable of emitting light for irradiating the surface and computing units for receiving light reflected from the surface to generate a characteristic value. Then, the apparatus fetches the characteristic values obtained from the sampling points at the same sampling timing during each scan and outputs the characteristic values. This enables the progress of the polishing to be monitored in accordance with the distance from the center of the surface.
REFERENCES:
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5838447 (1998-11-01), Hiyama et al.
patent: 5964643 (1999-10-01), Birang et al.
patent: 6159073 (2000-12-01), Wiswesser et al.
patent: 6399501 (2002-06-01), Birang et al.
patent: 6409576 (2002-06-01), Oguri et al.
patent: 6506097 (2003-01-01), Adams et al.
patent: 6632124 (2003-10-01), Adams et al.
patent: 6991516 (2006-01-01), David et al.
patent: 7003148 (2006-02-01), Shiomi et al.
patent: 7008295 (2006-03-01), Wiswesser et al.
patent: 7014531 (2006-03-01), Hansen
patent: 7025658 (2006-04-01), David
patent: 2002/0013007 (2002-01-01), Hasegawa et al.
patent: 2002/0016066 (2002-02-01), Birang et al.
patent: 1 072 359 (2001-01-01), None
patent: 2001-284300 (2001-10-01), None
patent: 02/18100 (2002-03-01), None
Kobayashi Yo-ichi
Mitani Ryuichiro
Ebara Corporation
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Polished state monitoring apparatus and polishing apparatus... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polished state monitoring apparatus and polishing apparatus..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polished state monitoring apparatus and polishing apparatus... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3882718