Polish process and slurry for planarization

Compositions: coating or plastic – Coating or plastic compositions – Polishes

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439693, 51509, B24B 100, C09G 102

Patent

active

058764909

ABSTRACT:
A slurry containing abrasive particles and exhibiting normal stress effects. The slurry further contains non-polishing particles resulting in reduced polishing rate at recesses, while the abrasive particles maintain high polish rates at elevations. This leads to improved planarization.

REFERENCES:
patent: 2556615 (1991-09-01), Keilholtz et al.
patent: 4478883 (1984-10-01), Bupp et al.
patent: 4554182 (1985-11-01), Bupp et al.
patent: 4752628 (1988-06-01), Payne
patent: 5225034 (1993-07-01), Yu et al.
patent: 5262354 (1993-11-01), Cote et al.
patent: 5304284 (1994-04-01), Jagannathan et al.
patent: 5445996 (1995-08-01), Kodera et al.
patent: 5480476 (1996-01-01), Cook et al.
patent: 5603739 (1997-02-01), Neuland
patent: 5636296 (1997-06-01), Garino
W.L. Silvernail et al, The Mechanism of Glass Polishing, The Glass Industry, vol. 52, pp.172-175, May 1971.

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