Polish pressure modulation in CMP to preferentially polish raise

Details Polish pressure modulation in CMP to preferentially polish raise Polish pressure modulation in CMP to preferentially polish raise

1998-08-14

2000-10-10

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451 36, 451 63, 451160, B24B 100

Patent

active

061296104

ABSTRACT:
A chemical-mechanical planarization (CMP) process is provided whereby cyclical pressure means varies the force against the wafer and polishing pad during the planarizing operation with the planarizing pad specially defined to have a relaxation time which is correlated with the force cycle so that the planarizing is enhanced. The relaxation time of the pad is greater than the downward an/or upward force cycle time on the wafer or pad and provides a planarizing process wherein the height of the pad during planarization is intermediate between a decompressed pad position and a compressed pad position typically encountered in a conventional CMP process.

REFERENCES:
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4313284 (1982-02-01), Walsh
patent: 4910155 (1990-03-01), Cote et al.
patent: 4918869 (1990-04-01), Kitta
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5104828 (1992-04-01), Morimoto et al.
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5486265 (1996-01-01), Salugsugan
patent: 5522965 (1996-06-01), Chisholm et al.
patent: 5647792 (1997-07-01), Katsuoka et al.
patent: 5722879 (1998-03-01), Cronin et al.
patent: 5769697 (1998-06-01), Nishio
patent: 5839947 (1998-11-01), Kimura et al.
Teres .TM.CMP System--Linear Planarization Technology (LPT) Lam Research Bulletin 1998.
Linerar Planarization Technology .TM.On Track Systems Inc., Product Bulletin.

Affiliated with

Also associated with

Rating

Polish pressure modulation in CMP to preferentially polish raise does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polish pressure modulation in CMP to preferentially polish raise, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polish pressure modulation in CMP to preferentially polish raise will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2252563