Point-of-use recycling of wafer cleaning substances

Details Point-of-use recycling of wafer cleaning substances Point-of-use recycling of wafer cleaning substances

1994-01-12

1997-05-27

Manoharan, Virginia

Distillation: processes, separatory

Distilling to separate or remove only water

134 10, 134 11, 134 12, 159DIG19, 203 13, 203 35, 203 40, 203 42, 203 49, 203 71, 4233942, 423488, 423531, B01D 334, C01B 1790

Patent

active

056328664

ABSTRACT:
A method of recycling and purifying cleaning chemicals used in the production of semiconductor circuits and containing hydrofluoric acid and or hydrochloric acid. Recycling of such chemicals is accomplished using separation and reconstitution steps Hydrofluoric acid and hydrochloric acid cannot be distilled directly from a chemical solution as they form azeotropes with water. A low vapor pressure substance such as sulfuric acid or phosphoric acid is used to break the azeotrope while increasing the purity of the recovered chemicals and decreasing disposal problems. The method is useable at the point of use of the chemicals.

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