Point of use mixing for LI/plug tungsten polishing slurry to imp

Compositions – Etching or brightening compositions

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Details

156345, 216 89, 252 794, 438693, H01L 2100, B44C 122

Patent

active

060174633

ABSTRACT:
An improved tungsten plug/Local Interconnect slurry for Chemical Mechanical Polishing which does not require inclusion of a chemical stabilizer. The slurry is made using a combination of two separate batch mixings of stable ingredients and Point-of Use mixing of portions of the two batches, whereby the oxidizers are combined with the coated abrasive mixture immediately prior to dispensing the slurry onto the polishing pad by combining selected flows from each of the two batches to form a total flow rate equal to the required rate of slurry flow onto the polishing pad.

REFERENCES:
patent: 5527423 (1996-06-01), Neville et al.
patent: 5626715 (1997-05-01), Rostoker

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