Pogo pin, the fabrication method thereof and test socket...

Details Pogo pin, the fabrication method thereof and test socket... Pogo pin, the fabrication method thereof and test socket...

2011-04-12

2011-04-12

Dinh, Phuong K (Department: 2839)

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

Reexamination Certificate

active

07922544

ABSTRACT:
Disclosed is a pogo pin including: a hollow body having a spring structure by spirally cutting at least a portion of an outer surface thereof; and a conductive material filling at least an inside of the body. According to the present invention, when testing a semiconductor package, error rate in contact between the package, the pogo pin and a test board can be remarkably reduced, and simultaneously can enhance rigidity and electrical conductivity of the pogo pin. Further, simple componentry of the pogo pin can facilitate its fabrication, reduce fabrication costs, and even foresee fabrication of a micro-pogo pin.

REFERENCES:
patent: 4307928 (1981-12-01), Petlock, Jr.
patent: 7154286 (2006-12-01), Marx et al.
patent: 7245138 (2007-07-01), Jeong et al.
patent: 101890987 (1998-07-01), None
patent: 2002022768 (2002-01-01), None
patent: 2004085260 (2004-03-01), None
patent: 555713 (2006-03-01), None
International Search Report dated Dec. 10, 2007, PCT Appl. No. PCT/KR2007/003807, filed Aug. 8, 2007, serving as the Concise Statement for Japanese Publications JP10189087, JP2002022768, and JP2004085260.
English Abstract of JP10189087, published on Jul. 21, 1998, “Pogo Pin,” serving as the Concise Statement of the relevance of JP10189087.
English Abstract of JP2002022768, published on Jan. 23, 2002, “Pogo Pin for Inspecting Integrated Circuit Package,” serving as the Concise Statement of the relevance of JP2002022768.
English Abstract of JP2004085260, published on Mar. 18, 2004, “Probe Pin and Contractor,” serving as the Concise Statement of the relevance of JP2004085260.

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