Pneumatic system for solder leveling apparatus

Details Pneumatic system for solder leveling apparatus Pneumatic system for solder leveling apparatus

1975-08-07

1978-04-11

Smith, Al Lawrence

Coating apparatus

With vacuum or fluid pressure chamber

118 63, 118425, 228 20, B05C 304

Patent

active

040833232

ABSTRACT:
A solder levelling machine which uses a hot gas emanating from opposed gas knives to remove excess molten solder from a printed circuit board as the board is withdrawn from a bath of molten solder contained in a self-purging solder pot. The hot gas clears the through-holes in the circuit board and allows a controllable desired thickness of solder to remain on the board and in the through holes. A pair of heaters supplies the hot gas to the knives through a manifolding arrangement.

REFERENCES:
patent: 2803216 (1957-08-01), Termini et al.
patent: 2903994 (1959-09-01), Hrubec
patent: 3431887 (1969-03-01), Pettigrew et al.
patent: 3661638 (1972-05-01), Lemecha
patent: 3795358 (1974-03-01), Sarnacki et al.
patent: 3865298 (1975-02-01), Allen et al.

Affiliated with

Also associated with

Rating

Pneumatic system for solder leveling apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pneumatic system for solder leveling apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pneumatic system for solder leveling apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-983816