Plural copper-layer treatment of copper foil and article made th

Details Plural copper-layer treatment of copper foil and article made th Plural copper-layer treatment of copper foil and article made th

1976-10-05

1979-12-25

Kaplan, G. L.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having variation in thickness

156151, 204 40, 204 44, 428612, 428642, 428675, 428936, C25D 510, C25D 358, B23P 300

Patent

active

RE0301809

ABSTRACT:
Copper foil is subjected to a two-step electrochemical copper treatment to improve its bond strength, the first step of said treatment involving the use of a copper and arsenic-containing electrolyte. A treatment involving the use of the aforementioned two-step electrochemical copper pretreatment prior to the application of an electrochemical copper treatment. Treated copper foil and printed circuit boards resulting therefrom.

REFERENCES:
patent: 2135873 (1938-11-01), Jones et al.
patent: 2802897 (1957-08-01), Hurd et al.
patent: 3220897 (1965-11-01), Conley et al.
patent: 3293109 (1966-12-01), Luce et al.

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