Plunger apparatus used in a resin molding device for encapsulati

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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Details

4251291, 425544, 425DIG228, 26427217, B29C 4502, B29C 4514

Patent

active

054605024

ABSTRACT:
An improved plunger apparatus used in a resin molding device for encapsulating electronic components. At least one annular recess is located in the bottom side of the plunger. The annular recess redirects the plasticized resin to flow towards the mold cavities in the molding device and away from the interface between the plunger and the cylinder of the molding device, thereby optimizing the flow of resin to the cavities and reducing the tendency of excess gas and resin to flow away from the cavities. At least one flat side is located in the lengthwise surface of the plunger. The flat side forms an enlarged clearance in the interface between the flat side and the cylinder of the molding device. The enlarged clearance receives and provides an outlet for any excess gas or resin that flows in the interface. The improved plunger still stably guides within the cylinder, and the improved plunger allows the molding apparatus to encapsulate electronic components more economically, efficiently, and effectively.

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