Pluggable semiconductor device package

Details Pluggable semiconductor device package Pluggable semiconductor device package

1976-05-03

1977-09-06

Lake, Roy

Geometrical instruments

H05K 112

Patent

active

040464423

ABSTRACT:
A semiconductor device package which can be readily mounted on a printed circuit board without requiring soldering or intermediate connectors. A supporting substrate has a unique lead frame configuration thereon in which the leads extend around side portions of the substrate and form integral spring contacts projecting from the lower surface of the substrate. The package preferably includes a metallic stud having a head portion mounted in the substrate for receiving a semiconductor device and a rod portion extending from the lower surface of the substrate. The rod portion of the stud can be removably secured in an aperture in a printed circuit board to engage the spring contacts with corresponding conductors on the circuit board.

REFERENCES:
patent: 3311790 (1967-03-01), Vizzier, Sr. et al.
patent: 3678385 (1972-07-01), Bruner
Arnold et al. Integrated Circuit Component; IBM Tech Disclosure Bulletin, vol. 12, No. 6, Nov. 1969, p. 793.

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