Plug-in package for microwave integrated circuit having cover-mo

Details Plug-in package for microwave integrated circuit having cover-mo Plug-in package for microwave integrated circuit having cover-mo

1989-02-08

1991-05-28

Lee, Benny T.

Communications: radio wave antennas

Antennas

Microstrip

343705, 343776, 343853, 343909, 333 33, 333247, 174 523, 174 525, 357 74, 361392, 361394, H01Q 1308, H01Q 128, H03H 738, H05K 506

Patent

active

050198297

ABSTRACT:
A TO-style plug-in package for MMICs and associated antenna structure is comprised of a microwave circuit component carrier having a generally cylindrically shaped conductive header upon which one or more MMICs are supported. An aperture through the header contains a conductor pin supported within a glass seal interface, so as to form a hermetically sealed matched impedance transmission line through the package. The conductor pin is connected to a bonding pad of a microwave circuit component on the header. A generally cylindrical conductive cover engages the header and encloses a cavity within which the microwave circuit components are supported. A microstrip antenna is supported on a dielectric layer overlying an outer surface of the conductive cover and is connected to a further conductor pin that extends through a glass-sealed aperture in the cover and forms a matched impedance transmission line from the antenna to the header. The interface between the further conductor pin and the header is configured to provide an effectively blind mated, matched impedance feed-through signal path, so as to facilitate attachment of the conductive cover to the header.

REFERENCES:
patent: 3349481 (1967-10-01), Karp
patent: 3549949 (1970-12-01), Granberry
patent: 3784726 (1974-01-01), Smith et al.
patent: 4771294 (1988-09-01), Wasiloosky

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