PLGA-BGA socket using elastomer connectors

Details PLGA-BGA socket using elastomer connectors PLGA-BGA socket using elastomer connectors

1999-12-14

2002-05-21

Tolin, Gerald (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S703000, C361S707000, C361S717000, C361S718000, C361S719000, C174S016300, C257S727000, C257S706000, C257S718000, C165S080200, C165S080300

Reexamination Certificate

active

06392887

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic assembly that contains an elastomeric connector. The elastomeric connector couples a ball grid array integrated circuit package to a substrate such as the motherboard of a computer.
2. Background Information
Integrated circuits are typically assembled into packages that are mounted to a printed circuit board. There are various types of integrated circuit packages including ball grid array (BGA) packages. BGA packages contain an integrated circuit that is mounted to a substrate. The package also contains a plurality of solder balls that are attached to a bottom surface of the substrate. The BGA substrate typically contains routing traces and vias that connect the solder balls to the integrated circuit. The solder balls can be re-flowed to mount the BGA package to another substrate such as the motherboard of a computer.
Because of manufacturing tolerances one or more of the solder balls may be smaller than the other balls. When re-flowed the smaller solder balls may not form a sufficient electrical connection between the BGA package and the motherboard. The insufficient connection may create an open circuit in the assembly. Additionally, the re-flow process and/or assembly process of the BGA package may create a warpage in the package. The warpage will create a lack of flatness that may result in electrical opens in the final assembly. It would be desirable to provide a BGA electronic package assembly that would reduce the probability of electrical opens in the assembly.
The re-flow process typically requires special solder re-flow equipment. This equipment is expensive to purchase and maintain. Additionally, the re-flow process can degrade both the motherboard and the BGA package. It would be desirable to provide an assembly process for a BGA package that does not require a re-flow of the solder balls.
SUMMARY OF THE INVENTION
One embodiment of the present invention is an electronic assembly that may include an elastomeric connector. The elastomeric connector may couple a solder ball of an integrated circuit package to a substrate


REFERENCES:
patent: 4664309 (1987-05-01), Allen et al.
patent: 5135402 (1992-08-01), Sweeney
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5321583 (1994-06-01), McMahon
patent: 5362656 (1994-11-01), McMahon
patent: 5420461 (1995-05-01), Mallik et al.
patent: 5506756 (1996-04-01), Haley
patent: 5594624 (1997-01-01), Clemens et al.
patent: 5702256 (1997-12-01), Severn
patent: 5751556 (1998-05-01), Butler et al.
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5791914 (1998-08-01), Loranger et al.
patent: 5810607 (1998-09-01), Shih et al.
patent: 5811883 (1998-09-01), Ichikawa et al.
patent: 5812379 (1998-09-01), Barrow
patent: 5815372 (1998-09-01), Gallas
patent: 5829988 (1998-11-01), McMillan et al.
patent: 5833471 (1998-11-01), Selna
patent: 5834335 (1998-11-01), Buschbom
patent: 5880528 (1999-03-01), Seshan et al.
patent: 5883783 (1999-03-01), Turturro
patent: 5889652 (1999-03-01), Turturro
patent: 5894410 (1999-04-01), Barrow
patent: 5905638 (1999-05-01), MacDonald, Jr. et al.
patent: 5917702 (1999-06-01), Barrow
patent: 5947751 (1999-09-01), Massingill
patent: 5973924 (1999-10-01), Gillespie, Jr.
patent: 5991161 (1999-11-01), Samaras et al.
patent: 6011696 (2000-01-01), Mahajan et al.
patent: 6046597 (2000-04-01), Barabi
patent: 6062873 (2000-05-01), Kato
patent: 6078500 (2000-06-01), Beaman et al.

Affiliated with

Also associated with

Rating

PLGA-BGA socket using elastomer connectors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with PLGA-BGA socket using elastomer connectors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and PLGA-BGA socket using elastomer connectors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2886807