Platinum silicide fuse links for integrated circuit devices

Details Platinum silicide fuse links for integrated circuit devices Platinum silicide fuse links for integrated circuit devices

1976-03-01

1977-08-16

Lynch, Michael J.

Electricity: electrothermally or thermally actuated switches

Electrothermally actuated switches

With longitudinally expansible solid element

337 4, 337290, 357 61, H01L 2704

Patent

active

040429504

ABSTRACT:
Selected circuit elements and interconnections of a integrated circuit device are connected by platinum silicide fuse links which open when electrical power exceeds a threshold amount. The fuse is constructed by defining the fuse geometry in a polycrystalline silicon layer over a wafer substrate, depositing a layer of platinum thereover and then sintering the platinum into the polysilicon.

REFERENCES:
patent: 3699395 (1972-10-01), Boleky
patent: 3753774 (1973-08-01), Velarie
patent: 3783506 (1974-01-01), Rehfeld
patent: 3792319 (1974-02-01), Tsang
Fogiel, Modern Microelectronics, Copyright 1972, pp. 460-463.
Kircher, et al., "Interconnection Method for Integrated Circuits," IBM (TDB), vol. 13, No. 2, July 1970, p. 436.

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