Platinum electroforming and platinum electroplating

Details Platinum electroforming and platinum electroplating Platinum electroforming and platinum electroplating

1991-06-21

1994-05-10

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

205 69, 205 70, 205 72, 205 73, 205264, C25D 100, C25D 110

Patent

active

053104757

ABSTRACT:
The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size. The platinum electroforming or electroplating bath comprises at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum and a hydroxylated alkali metal, 20-100 g/l.

REFERENCES:
patent: 2451340 (1948-10-01), Jernstedt
patent: 3923612 (1975-12-01), Wiesner
patent: 4664758 (1987-05-01), Grey
patent: 5013409 (1991-05-01), Czor
Indira et al., "Addition Agent for Platinum Plating", Metal Finishing, May 1969, pp. 44-49.
Lowenheim F. A., "Electroplating", McGraw-Hill Co., New York, 1978, Chapter 20, pp. 426-441.

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