Platinum electroforming and platinum electroplating

Details Platinum electroforming and platinum electroplating Platinum electroforming and platinum electroplating

1995-01-24

1996-06-25

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

205 69, 205 70, 205 72, 205 73, 205264, C25D 100

Patent

active

055296807

ABSTRACT:
The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size utilizing an electrolyte bath comprising at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum; a hydroxylated alkali metal, 20-100 g/l; and a soluble carboxylate.

REFERENCES:
patent: Re34862 (1995-02-01), Czor
patent: 5310475 (1994-05-01), Kitada et al.
Indira et al, "Addition Agent for Platinum Plating", Metal Finishing, May 1969, pp. 44-49.

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