Plating system

Details Plating system Plating system

1991-02-25

1992-10-06

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204297W, C25D 1706

Patent

active

051528819

ABSTRACT:
Apparatus for plating electrical or electronic components, comprises a plating chamber (2) for receiving electrolyte through which a current is to be passed via a first anode (10) and cathode (13) pair, means being provided to arrange a component (12) to be plated as the cathode of said first pair, means for supplying the plating chamber with electrolyte enriched with plating material, the supplying means including a reservoir chamber (4) for receiving electrolyte through which a current is to be passed via a second anode and cathode pair (21,22), means being provided to arrange a body of plating material (17) as the anode of said second pair, whereby in use plating material dissolved from the anode of the second pair enriches the electrolyte supplied to the plating chamber (2) and is deposited on the cathode of the first pair. The component (12) may be an integrated circuit strip package or the like, and may be carried during plating by a carrier (11) which comprises upper and lower supports for engaging respective longitudinal edges of the strip along the length thereof.

REFERENCES:
patent: 3039951 (1962-06-01), Clenard et al.
patent: 4088559 (1978-05-01), Sandmeier et al.
patent: 4561960 (1985-12-01), Jeannot et al.
patent: 4643128 (1987-02-01), Bracher et al.
patent: 4752371 (1988-06-01), Kriesel et al.
patent: 4855032 (1989-08-01), Fabrian et al.
patent: 4899966 (1990-02-01), Antos et al.
"Spring-Type Tension Tip", Metal Finishing, vol. 86, No. 1A, p. 768 (1988).

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